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 SPD30N03S2L-10 G
OptiMOS(R) Power-Transistor
Feature
* N-Channel
Product Summary VDS R DS(on) ID 30 10 30
PG-TO252-3
V m A
* Enhancement mode * Logic Level * Low On-Resistance R DS(on) * Excellent Gate Charge x R DS(on) product (FOM)
* Superior thermal resistance
* 175C operating temperature * Avalanche rated * dv/dt rated
Pb-free lead plating; RoHS compliant
Type
Package
Marking 2N03L10
SPD30N03S2L-10G PG-TO252-3
Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous drain current1)
TC=25C
Symbol ID
Value 30 30
Unit A
Pulsed drain current
TC=25C
ID puls EAS EAR dv/dt VGS Ptot T j , Tstg
120 150 10 6 20 100 -55... +175 55/175/56 kV/s V W C mJ
Avalanche energy, single pulse
ID=30 A , V DD=25V, RGS=25
Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt
IS=30A, VDS=24V, di/dt=200A/s, T jmax=175C
Gate source voltage Power dissipation
TC=25C
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Page 1
02-09-2008
SPD30N03S2L-10 G Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area
3)
Symbol min. RthJC RthJA RthJA -
Values typ. 1 max. 1.5 100 75 50
Unit
K/W
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Static Characteristics Drain-source breakdown voltage
V GS=0V, ID=1mA
Symbol min. V(BR)DSS VGS(th) IDSS IGSS RDS(on) RDS(on) 30 1.2
Values typ. 1.6 max. 2
Unit
V
Gate threshold voltage, VGS = V DS
ID=50A
Zero gate voltage drain current
V DS=30V, VGS=0V, Tj=25C V DS=30V, VGS=0V, Tj=125C
A 0.01 10 1 11.2 7.8 1 100 100 14.6 10 nA m
Gate-source leakage current
V GS=20V, VDS=0V
Drain-source on-state resistance
V GS=4.5V, I D=30A
Drain-source on-state resistance
V GS=10V, I D=30
1Current limited by bondwire ; with an RthJC = 1.5K/W the chip is able to carry ID= 76A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2
02-09-2008
SPD30N03S2L-10 G
Electrical Characteristics Parameter Dynamic Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time
Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Qgs Qgd Qg
VDD =24V, ID =30A, VGS =0 to 10V VDD =24V, ID =30A
Symbol
Conditions min.
Values typ. 47.5 1160 450 120 6.1 13 27 17 max. -
Unit
gfs Ciss Coss Crss td(on) tr td(off) tf
VDS 2*ID *RDS(on)max, ID =30A VGS =0V, VDS =25V, f=1MHz
23.8 -
S
1550 pF 600 175 9.2 20 41 26 ns
VDD =15V, VGS =10V, ID =30A, RG =5.4
-
3.7 10.9 31.4 3.4
4.9 16.3 41.8 -
nC
V(plateau) VDD =24V, ID =30A
V
Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr
V GS=0V, IF=30A V R=-V, IF=lS, diF/dt=100A/s
IS
TC=25C
-
0.9 31 29
30 120 1.2 39 37
A
V ns nC
Page 3
02-09-2008
SPD30N03S2L-10 G 1 Power dissipation Ptot = f (TC) parameter: VGS 4 V
110
SPD30N03S2L-10
2 Drain current ID = f (T C) parameter: VGS 10 V
32
SPD30N03S2L-10
W
90 80
A
24
P tot
ID
100 120 140 160 C 190
70 60
20
16 50 40 30 20 4 10 0 0 20 40 60 80 0 0 20 40 60 80 12
8
100 120 140 160 C 190
TC
TC
3 Safe operating area ID = f ( VDS ) parameter : D = 0 , TC = 25 C
10
3 SPD30N03S2L-10
4 Max. transient thermal impedance Z thJC = f (t p) parameter : D = t p/T
10
1 SPD30N03S2L-10
K/W A
10
/I
D
0
t = 10.0s p
ID
V
DS
10
2
Z thJC
100 s
10
R
DS (on )
=
-1
D = 0.50 10 10
1 1 ms -2
0.20 0.10 single pulse 0.05 0.02 0.01
10
-3
10
0
10
-1
10
0
10
1
V
10
2
10
-4
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 4
tp
02-09-2008
SPD30N03S2L-10 G 5 Typ. output characteristic ID = f (V DS); T j=25C parameter: tp = 80 s
SPD30N03S2L-10
6 Typ. drain-source on resistance RDS(on) = f (I D) parameter: VGS
32
SPD30N03S2L-10
75
A
Ptot = 100W
V [V] GS a b c
m
fe d
b
c
60 55 50
c
3.0 3.5 4.0 4.5 5.0 5.5
d e f
R DS(on)
24
ID
45 40 35 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5
a b
20
16
12
d e
8
f
4 VGS [V] =
b 3.5 c 4.0 d 4.5 e 5.0 f 5.5
4
V
0 5 0 10 20 30 40
A
60
VDS
ID
7 Typ. transfer characteristics ID= f ( V GS ); V DS 2 x ID x RDS(on)max parameter: tp = 80 s
60
8 Typ. forward transconductance g fs = f(I D); T j=25C parameter: g fs
60
A
50 45
S
50 45
35 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4
g fs V5 VGS
ID
40
40 35 30 25 20 15 10 5 0 0 10 20 30 40
A ID
60
Page 5
02-09-2008
SPD30N03S2L-10 G 9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 30 , VGS = 10 V
24
SPD30N03S2L-10
10 Typ. gate threshold voltage VGS(th) = f (T j) parameter: VGS = VDS
2.5
m
20
V V GS(th)
0,4mA
R DS(on)
18 16 14 12 10 8 6 typ 98%
1.5
50A
1
0.5 4 2 0 -60 -20 20 60 100 140 C 200 0 -60 -20 20 60 100
C Tj
180
Tj
11 Typ. capacitances C = f (V DS) parameter: VGS=0V, f=1 MHz
10
4
12 Forward character. of reverse diode IF = f (V SD) parameter: T j , tp = 80 s
10
3 SPD30N03S2L-10
A
pF
10
2
10
3
Coss
10
1
IF
C
Ciss
T j = 25 C typ T j = 175 C typ
Crss
T j = 25 C (98%) T j = 175 C (98%)
10
2
10 5 10 15 20
0
0
V
30
0
0.4
0.8
1.2
1.6
2
2.4 V
3
V DS
VSD
Page 6
02-09-2008
SPD30N03S2L-10 G 13 Typ. avalanche energy E AS = f (T j) par.: I D = 30 A , V DD = 25 V, R GS = 25
160
14 Typ. gate charge VGS = f (QGate) parameter: ID = 30 A pulsed
16
SPD30N03S2L-10
mJ
V
120
12
E AS
100
VGS
10
0,2 VDS max
0,8 VDS max
80
8
60
6
40
4
20
2
0 25
45
65
85
105
125
145
C 185 Tj
0 0 5 10 15 20 25 30 35 40 nC 50
QGate
15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: ID=10 mA
36
SPD30N03S2L-10
V
V(BR)DSS
34 33 32 31 30 29 28 27 -60
-20
20
60
100
140 C
200
Tj
Page 7
02-09-2008
SPD30N03S2L-10 G Package outline: PG-TO252-3
Page 8
02-09-2008
SPD30N03S2L-10 G
Page 9
02-09-2008


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